MCP serverio.github.magiccadai/magicon
RF module design: transmit, receive and T/R chains, stackup, thermal, PDN and compliance.
Overview
Score?
UNRATED 0.050
of what a free look can see, on 2 looks
Looks
3
last 11 hr ago
Tools
9
More info
URL
api.pcbgenerator.com/mcp/
streamable-http
Says it is
magicon 1.0.0
protocol 2025-06-18
In the record since
2 days ago
Among servers18,413 with a card
0median 0.606 · this server 0.050 · highest on record 0.8561
Toolsfrom sha256:43af60ca4a…da8b2a
| Tool | Schema |
|---|---|
| check_grounding Check a draft passage against the engine results computed in THIS session. It returns every figure no engine produced, and every claim it checks that the results do not support or |
input · no output |
| design_rf_chain Design a complete RF transmitter chain with the convergent orchestrator: selects the driver, PA, filter, and connector (the signal source is the user's input power by default — no |
input · no output |
| design_rf_receiver Design or analyse a superheterodyne RECEIVER. Selects catalog parts for each slot (limiter, LNA, image filter, mixer, LO, IF filter, IF amp, step attenuator) and returns the freque |
input · no output |
| design_tr_module Design a T/R (transmit/receive) module that shares ONE antenna between a transmitter and a receiver. Designs both chains through the existing engines, selects the shared front end |
input · no output |
| run_compliance_analysis Audit the solved stackup against PCB standards (IPC-2221, IPC-6012, IPC-4101, MIL, UL-94, RoHS, REACH): per-rule pass/fail with severities and remediation. Reuses the engine behind |
input · no output |
| run_link_budget Compute a cascaded RF link budget. For the chain just designed, call with NO arguments — the server derives stages and input power from the design. Pass stages + inputPowerDbm only |
input · no output |
| run_pdn_analysis Run a PDN (power delivery network) impedance analysis: interplanar plane-pair capacitance, multi-cap decoupling impedance vs. target impedance, violations, and recommended decoupli |
input · no output |
| run_stackup_solver Run the impedance-aware stackup constraint solver to find optimal PCB configurations. Use when the user wants ranked material/thickness/copper solutions for a given layer count and |
input · no output |
| run_thermal_analysis Run a full PCB thermal analysis: via array Rth, junction-to-ambient stack, Kennedy spreading, Coffin-Manson barrel stress, Timoshenko warpage, and resin-flow estimation. Mirrors PO |
input · no output |
Verify it yourself
npx teppi-check https://api.pcbgenerator.com/mcp/curl -s https://api.teppi.xyz/v1/trust/mcp/mcs_01M3XM3QNWGY4XF4NADF3PBBEF